About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Experimental investigation of thermal conductivity during aging of
nanoporous sintered silver |
| Author(s) |
Xavier Milhet, Yann Billaud, Anas Sghuri, Loic Signor, Didier Saury |
| On-Site Speaker (Planned) |
Xavier Milhet |
| Abstract Scope |
Silver paste (Ag) sintering is used as a die-bonding technology in the latest generation of power electronic modules as Ag offers a high melting temperature, excellent thermal and electrical conductivities. However, due to certain limitation, Ag sintering produces a porous joint. The relationship between its density and its thermal conductivity remains an issue since access to the density of an embedded thin joint is challenging. In this study, the thermal conductivity as a function of porosity and thermal aging conditions were investigated using a 3D flash method on specimens sintered under various pressures. The relationship between porosity and thermal conductivity is established for the as-sintered state and after aging up to 500 h at temperatures ranging from 150 ◦C to 350 ◦C and is compared to existing models. The evolution of the thermal properties during thermal aging is discussed considering both the elaboration conditions and the microstructure evolution. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Characterization, |