About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Plasma-Enhanced Polyimide Bonding via Surface Modification |
| Author(s) |
Heng-Ching Mie, Sheng-Sheng Yu, Yu-Chen Liu, Jun Mizuno, Yu-hao Lo, Jiun-Ruei Wang, Chien-Shuo Huang, Huang Hong Ru |
| On-Site Speaker (Planned) |
Heng-Ching Mie |
| Abstract Scope |
This study explores Cu/dielectric hybrid bonding using polyimide (PI) as the dielectric layer, focusing on the effects of O₂ plasma surface treatment. Surface characterization via AFM, contact angle, and XPS reveals that moderate plasma power enhances surface hydrophilicity and roughness, improving interfacial contact. Excessive roughness, however, leads to void formation and reduced bonding strength. Under optimized conditions within relatively short time (20 min), a shear strength of ~19 MPa was achieved, demonstrating that controlled plasma treatment significantly improves PI/PI bonding reliability. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Surface Modification and Coatings, Electronic Materials, Polymers |