About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Fatigue in Materials: Fundamentals, Multiscale Characterizations and Computational Modeling
|
| Presentation Title |
Mechanistic Modeling of Microstructure-Sensitive Crack Growth |
| Author(s) |
Vasilis Karamitros, Thomas H Siegmund, Michael D Sangid |
| On-Site Speaker (Planned) |
Vasilis Karamitros |
| Abstract Scope |
The increasing use of additively manufactured (AM) IN718 in damage tolerant applications necessitates the development of mechanistically rigorous, microstructure-sensitive models for predicting fatigue life and crack growth. Conventional formulations, such as Paris law, cannot capture the complex, heterogeneous crack propagation behavior inherent to AM microstructures. Thus, in this work, an energy-based constitutive model using experimental results from far field high energy X-ray diffraction microscopy (FF-HEDM) and micro-computed tomography (μCT) is formulated for reconstructing the 3D IN718 microstructure and the experimental crack path, respectively. A crystal plasticity framework is established using the critical plastic strain energy ahead of the crack tip as the mechanistic driver for short crack growth. The quantitative comparison performed between the predicted and experimental-derived grain-averaged stresses ahead of the crack tip (from FF-HEDM) and crack growth paths (from μCT) demonstrates the predictive fidelity of the proposed methodology and advances the mechanistic modeling of microstructure-sensitive short crack growth. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Modeling and Simulation, Mechanical Properties |