About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Microstructural Fingerprints for Secure Microelectronic Packaging |
| Author(s) |
Min Cho, Eshan Ganju, Nikhilesh Chawla |
| On-Site Speaker (Planned) |
Min Cho |
| Abstract Scope |
Counterfeiting in electronic packages has become a huge problem for semiconductor industry over the years. In this talk, we focus on novel hierarchical microstructural fingerprint made by X-ray curing of Tantalum particles in the resin matrix. The random distribution of particles embedded in the resin creates unique signatures. Any changes to the signatures allow users to detect counterfeited electronics. Lab scale X-ray microtomography was used to both drive curing and imaging of the internal microstructural fingerprint. Particle movements depicted in the time-resolved X-ray radiographs were analyzed to determine heterogeneity in curing. In addition, a shear peeling test using a blade was performed to test the adhesion of the cured fingerprint. The adhesion strength of the cured resin on a substrate, as a function of film thickness, strain rate, and blade angles, was investigated and will be discussed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Characterization, Composites |