About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Alloys and Compounds for Thermoelectric and Solar Cell Applications XIV
|
| Presentation Title |
B-10: Interfacial Reactions of Ag-66.7at.%Te / Co, and the Microstructural Evolution of Te Whisker Growth Under Current Stressing |
| Author(s) |
Yung-Chun Tsai, Han-Chen Lin, Cheng-Hsi Ho, Wei-Chen Teng, Sinn-wen Chen |
| On-Site Speaker (Planned) |
Yung-Chun Tsai |
| Abstract Scope |
Ag-Te is an important thermoelectric material system, and Co serves as a potential diffusion barrier. Electromigration refers to atom migration under electric current, which can significantly influence the microstructure of the material. In this study, the Ag-66.7 at.% Te eutectic composition was selected to examine interfacial reactions with Co at 200 °C and 300 °C. In addition, current stressing was applied to investigate its effect on the microstructure of the Ag-66.7 at.%Te alloy. In the Ag-66.7at.%Te /Co couple reacted at 200℃, two reaction phases, β-CoTe and β-Ag5Te3, were formed. In the Ag-66.7at.%Te /Co couple reacted at 300℃, three reaction phases, β-CoTe, ϒ-CoTe2 and β-Ag5Te3, were formed. Interestingly, during current stressing experiments on Ag-66.7 at.%Te alloy, unexpected whisker growth was observed. Subsequent analysis confirmed that these whiskers were composed of tellurium and exhibited a distinctive needle-like microstructure. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Other, Other |