About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Chemistry and Physics of Interfaces
|
| Presentation Title |
Localized Grain Boundary Engineering via Thermo-Elastic-Processing (TEP) |
| Author(s) |
Wenwu Xu, Marivel Alfaro, Runjian Jiang, Sky Soltero, James Burns, Adrian Contreras, Colin Delaney, Christopher Foronda, Michele Pavao |
| On-Site Speaker (Planned) |
Marivel Alfaro |
| Abstract Scope |
Localized grain boundary engineering is often limited by routes that require bulk plastic deformation or strong segregation chemistries. Here we introduce thermal-elastic processing (TEP), which combines a room‑temperature elastic preload with a sub‑solidus dwell to drive micron‑scale interfacial transformations while preserving bulk shape. Using coarse‑grained polycrystalline aluminum ingot (average grain size about 280μm), a 10MPa preload followed by a 30min dwell at 473K produces boundary serration/faceting without measurable grain growth. A mechanistic model quantifies stress amplification and dislocation pile‑up adjacent to boundaries, predicting a ~1-3.5μm plastically affected zone; Arrhenius grain boundary diffusion over the same annealing time gives Ld≈35μm at 473K, so diffusion is not rate‑limiting. Diffusion creep bounds (Coble) predict <10-7 bulk strain in 30min for d=280μm, consistent with shape retention. TEP offers a general route to local grain‑boundary morphology control without macroscopic plasticity. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Process Technology, Characterization, Thin Films and Interfaces |