About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Accelerating Innovation in Materials and Manufacturing
|
| Presentation Title |
Ultrasonic Welding of Aluminum to Silicon |
| Author(s) |
Syed Rizvi, Fu-Yun Tsai, Farhan Ishrak, Bharat Gwalani, Elizabeth Kautz |
| On-Site Speaker (Planned) |
Syed Rizvi |
| Abstract Scope |
Ultrasonic welding is a solid-state joining process that utilizes high-frequency mechanical vibrations to produce metallurgical bonds with minimal bulk heating. The process is particularly attractive for joining dissimilar materials that are difficult to bond using conventional fusion welding techniques. In this study, aluminum foil was ultrasonically welded to a silicon substrate to evaluate the feasibility of metal–semiconductor joining. The bonded interface was characterized using scanning electron microscopy with energy dispersive spectroscopy (SEM–EDS) and transmission electron microscopy (TEM). Microstructural analysis revealed a continuous, well-bonded interface with minimal damage or distortion to the silicon substrate. The results demonstrate the potential of ultrasonic welding for producing high-quality Al–Si joints while preserving the integrity of the brittle silicon, making this technique promising for electronic packaging and semiconductor applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Aluminum, Thin Films and Interfaces, Joining |