About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
|
| Presentation Title |
Microstructure-Dependent Crack Evolution and Creep Response of Sb-added Sn–Bi Low-Temperature Solders |
| Author(s) |
Yu-Chia Chang, Zhi-Chen Ai, Yu-chen Liu |
| On-Site Speaker (Planned) |
Yu-Chia Chang |
| Abstract Scope |
The mechanical reliability of Sn–Bi low-temperature solders is closely related to their microstructure, crack evolution, and creep response under high-homologous-temperature conditions. Although Sb addition may improve ductility, excessive Sb can induce intermetallic compound formation and change fracture behavior. In this study, Sn–58Bi, Sn–57Bi–1Sb, and Sn–55Bi–3Sb alloys were prepared by melting and casting to clarify how Sb-induced microstructural changes affect deformation and failure. SEM/EDS, XRD, DSC, and CALPHAD analyses were used to identify phase constitution, while in-situ tensile testing inside a scanning electron microscope was conducted to observe crack initiation and propagation. Creep tests were performed at 60, 70, and 80 °C to evaluate time-dependent deformation. The results indicate that Sn–57Bi–1Sb promotes crack deflection and strain accommodation, whereas coarse SnSb compounds in Sn–55Bi–3Sb act as brittle crack initiation sites and influence creep response. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Mechanical Properties, Joining |