About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Cu-core solder interconnect Joule heat induced temperature rise under high density current stressing |
| Author(s) |
Tae-Kyu Lee, Yujin Park, Gnyaneshwar Ramakrishna, Young-Woo Lee, Hui-Joong Kim, Choong-Un Kim |
| On-Site Speaker (Planned) |
Tae-Kyu Lee |
| Abstract Scope |
The need for higher power per AI network and high performance chip lead the demand of higher current density. The associated Joule heating induced temperature rise which can accelerate the diffusion driven elemental migration. Comparing to Sn-base solder alloy interconnects, the implementation of a Cu-core is considered to improve the power delivery due to a lower resistance value, but the actual performance per current stressing has various factors to be considered. The intermetallic compound layer interaction to the Joule heat induced temperature rise and the actual performance under high density current stressing conditions are investigated.
Cu-core solder balls coated with and without SAC305 coating layer with 300m diameters are compared to full SAC305 solder joint configuration. Current stressing up to 6000 A/cm2 were applied with a joint temperature of 110oC. The long-term current stressed joint electrical performance and the microstructure evolution per configuration are analyzed and discussed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Mechanical Properties |