About this Abstract |
| Meeting |
MS&T26: Materials Science & Technology
|
| Symposium
|
Energy Materials for Sustainable Development
|
| Presentation Title |
Peltier–Bell Heat Pumping: Lateral Solid-State Thermal Management for 3D Integrated and Photonic Systems |
| Author(s) |
Chris Caylor, Lon Bell, Doug Crane |
| On-Site Speaker (Planned) |
Lon Bell |
| Abstract Scope |
This talk introduces Peltier–Bell (PB) heat pumping, an active solid-state thermal management technology that controls lateral heat transport within devices and packages. PB devices operate by exploiting spatial variations in Seebeck coefficient to generate distributed Peltier cooling, absorbing heat in targeted regions and transporting it laterally to remote heat rejection sites. In contrast to thermoelectric systems, PB performance is governed by electrical transport properties (power factor) rather than by the figure of merit Z (power factor/thermal conductivity) which governs the performance of thermoelectric systems. PB increases heat spreading operation at near-zero temperature differential (ΔT ≈ 0 K), allowing proactive suppression of hotspot formation with an active, controllable heat spreader. Proof-of-concept devices and modeling indicate that PB systems can achieve 2–7× higher heat pumping capacity than thermoelectric devices of similar size, with high thermal conductance and order(s) of magnitude fast response times. |