About this Abstract |
| Meeting |
2026 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2026)
|
| Symposium
|
2026 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2026)
|
| Presentation Title |
A Rheological Approach to Measuring Cure Depth of Soft Photopolymers |
| Author(s) |
Daniel Rau, Charles A. Yeboah |
| On-Site Speaker (Planned) |
Charles A. Yeboah |
| Abstract Scope |
Vat photopolymerization (VP) builds 3D structures through the layer-by-layer photocuring of liquid photopolymer resins, and the accurate measurement of UV exposure versus cure depth is critical for high-fidelity printing. However, measuring the cure depth of soft resins is extremely difficult as conventional measurements deform the soft and thin films, corrupting the measurement. We advance a photorheology-based approach to measure the cure depth of soft elastomers under process-relevant UV irradiance and wavelengths. To ensure accuracy, we replace the conventional normal-force based measurements with a torque-based detection method to eliminate compression of the soft materials. Because photocuring behavior is highly dependent on the specific UV source used, we also explore using resin absorption and UV source spectra to translate curing behavior between different UV sources. Together, these advances help translate rheometer measurements of cure depth to printer-specific conditions, supporting reliable VP of soft photopolymers across a range of UV sources. |
| Proceedings Inclusion? |
Undecided |