About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Thermomechanical Correlation of Interfacial Shear and Warpage in Cu–Cu Bonded 3D Stacked Die Packages Thermal Cycling |
| Author(s) |
Yong Jie Wong, Mohd Sharizal Abdul Aziz, Chu Yee Khor, Kim Hoey Yeoh, Chze Shen Ang, Teng Hwang John Tan |
| On-Site Speaker (Planned) |
Yong Jie Wong |
| Abstract Scope |
Warpage in Cu–Cu bonded stacked die structures is governed by the interplay between interfacial stress and silicon deformation during thermal cycling. This study establishes a time-resolved correlation framework linking interfacial shear stress behavior to Z-directional warpage of the silicon die. Three shear-based metrics are formulated: the Shear Amplification Index, capturing zonal stress escalation; the Shear Spread Index, quantifying spatial imbalance; and the Shear Peak Index, identifying maximum local shear intensity. Each metric is computed at every timestep across five interconnect heights using transient finite element simulations. Warpage is extracted concurrently and correlated with each metric using Pearson correlation analysis. The results reveal height-sensitive and temporally evolving relationships that characterize how interfacial shear governs global deformation. This framework provides a scalable approach to quantify the mechanical coupling between interface-level stress phenomena and system-level reliability outcomes in advanced 3D integrated packaging. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Modeling and Simulation, Joining, Electronic Materials |