About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
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| Presentation Title |
Enhancing Thermo-Mechanical Reliability of Through-Glass Vias in Panel-Level Packaging Using Taguchi-Optimized PSPI Buffer Layers |
| Author(s) |
Heng-Ching Mie, Jun Mizuno |
| On-Site Speaker (Planned) |
Heng-Ching Mie |
| Abstract Scope |
As Moore’s law slows, glass-based panel-level packaging (PLP) using the CoPoS architecture offers critical high I/O density for AI chips via through-glass vias (TGVs). However, TGV reliability is compromised by the coefficient of thermal expansion (CTE) mismatch between glass and copper, glass brittleness, and wet-etching defects. To resolve these thermo-mechanical issues, this study proposes a photosensitive polyimide (PSPI) stress buffer layer. Using the Taguchi method for precise coating optimization, this low-modulus polymer effectively reduces the energy release rate. Results demonstrate that the PSPI layer maximizes its thickness at the highly stressed glass/Cu interface and seamlessly fills etching-induced "scallop structure", preventing further stress concentration. Finally, thermal cycling tests validate that this buffer layer substantially enhances the overall thermo-mechanical reliability of TGV structures, presenting a practical solution for advanced semiconductor packaging. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Other, |