About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
2026 Technical Division Student Poster Contest
|
| Presentation Title |
SPG-80: Effect of In and Ni on Microstructure-Property Correlation and Diffusional Kinetics of Alloyed Sn-Based Solder/Cu Systems for Interconnect Applications |
| Author(s) |
Ayushi Thakur, Sangeeta Santra, Jayant Jain |
| On-Site Speaker (Planned) |
Ayushi Thakur |
| Abstract Scope |
In this work Sn-0.7Cu solder was alloyed with traces of In and Ni to evaluate their effect on phase chemistry, microstructure, and thermal behaviour. The role of In in enhancing the compressive strength was assessed through solid-solution and precipitate strengthening mechanisms. The Charpys impact toughness tests were conducted to estimate the ductile to brittle transition temperature (DBTT) of the In- and Ni-alloyed solders and the influence of the microstructure and intermetallic compounds (IMCs) on the impact toughness was analysed via microstructure-property correlation. The growth kinetics of the interdiffusion zone constituting the Cu6Sn5 and Cu3Sn phases (IMCs) at the Sn(0.7Cu)/Cu diffusion couple were also studied to understand the effect of alloying, mimicking the interconnect geometry. The interdiffusion zone was found to grow parabolically with time. Integrated diffusion coefficients have been estimated, and the growth kinetics were rationalized by thermo-kinetics approach integrated with the first-principles studies. |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Other, Characterization, Other |