About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Indium Alloying in Sn-58Bi Low-Temperature Solder and its Effect to the Microstructure, Thermal and Mechanical Properties. |
| Author(s) |
Muhammad Hafiz Zan@Hazizi, Mohd Arif Anuar Mohd Salleh, Flora Somidin, Nur Syahirah Mohamad Zaimi |
| On-Site Speaker (Planned) |
Muhammad Hafiz Zan@Hazizi |
| Abstract Scope |
The Sn-58Bi eutectic solder is a promising lead-free alternative due to its low melting point, but its brittleness limits its application. This study investigates the effects of Indium (In) addition at 6.5, 10.5, and 12 wt.% on the microstructure, thermal behavior, solderability, and mechanical properties of Sn-58Bi solder. Alloys were prepared via casting and analyzed using DSC, SEM/EDX, tensile testing, and synchrotron-based XRD and micro-XRF. Results showed that In addition lowered the melting point to 116.33°C and improved ductility from 10% to 16%, though tensile strength decreased. InBi phase formation and Bi coarsening were also observed. Wetting time improved at higher In content, and thin IMC layers formed at the Cu interface. These findings demonstrate that In effectively enhances ductility, lowers the melting point, slightly improves the wetting time, and modifies the microstructures, making the solder alloys a viable option for electronic packaging. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Electronic Materials, |