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Meeting 2026 TMS Annual Meeting & Exhibition
Symposium Additive Manufacturing Modeling, Simulation and Artificial Intelligence
Presentation Title Thermomechanical Crystal Plasticity Study of HCP Ti Under Solid State Thermal Cycling
Author(s) Anderson Nascimento, Sarah Paguaga, Irene Beyerlein
On-Site Speaker (Planned) Anderson Nascimento
Abstract Scope Hexagonal close-packed (hcp) titanium exhibits strong anisotropy and pronounced temperature sensitivity in its plastic response, especially under thermomechanical loading conditions relevant to solid state thermal cycling (SSTC), prevalent in additive manufacturing processes. We investigate the interplay between plastic deformation and thermal expansion in hcp Ti using a fully coupled thermomechanical crystal plasticity framework. The model incorporates anisotropic thermal expansion through an eigenstrain formulation and captures slip system-level thermally activated behavior. The constitutive equations are implemented in a crystal plasticity finite element method and applied to simulate micromechanical fields during SSTC. The framework is used to assess the influence of anisothermal expansion on the development of residual stress in polycrystalline aggregates. Emphasis is placed on the role of thermal anisotropy in shaping inter- and intragranular stress distributions throughout cyclic thermal loading.
Proceedings Inclusion? Planned:
Keywords Additive Manufacturing, ICME, Titanium

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