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Meeting 2026 TMS Annual Meeting & Exhibition
Symposium Ultrafine-Grained and Heterostructured Materials (UFGH) XIV
Presentation Title Strain rate sensitivity of nanocrystalline copper: mapping across modeling and experimental techniques
Author(s) Madison Wenzlick, Wissam A. Saidi, Laxman Bhatta, Isshu Lee, Megumi Kawasaki
On-Site Speaker (Planned) Madison Wenzlick
Abstract Scope Quantifying structure-property relationships is key for understanding material deformation mechanisms. Well-established trends including the Hall-Petch equation capture the influence of grain size on mechanical properties, however, additional complexities are introduced in rate sensitive behavior which plays a role in long-term deformation processes including creep. Molecular dynamics (MD) enables insights into the material system to be gained by simulating the tensile response of nanograined materials under varying strain rates. Due to the high strain rates used in MD simulations, evaluating the effect of the relative strain rate is critical for comparing the simulated results with experimental values. To demonstrate the effects of grain size and strain rate, the tensile behavior of nanocrystalline copper (Cu) was modeled using MD and results were compared with experimentally measured values for bulk nanostructured Cu samples. The relationship between tensile strength, grain size and strain rate sensitivity at a wide range of strain rates are explored.
Proceedings Inclusion? Planned:
Keywords Copper / Nickel / Cobalt, Computational Materials Science & Engineering, Mechanical Properties

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