About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Stress and Temperature Driven Crossover in Deformation Mechanisms in Cu-based Thin Films |
| Author(s) |
Piyush Jagtap |
| On-Site Speaker (Planned) |
Piyush Jagtap |
| Abstract Scope |
The thermo-mechanical behavior of Cu-based thin films was studied using the wafer curvature technique. The stress-relaxation behavior of Cu and Cu-alloy films was investigated using analytical models to probe the underlying deformation mechanisms. The inherent asymmetry in stress magnitude and dislocation density during heating and cooling legs of a thermal cycle produces very different signatures of deformation mechanisms. During the heating segment, where both stress and dislocation density drop, both diffusional and dislocation-mediated deformation were observed. In contrast, during cooling segment, where stress and dislocation density builds up a clear transition from diffusional creep to power-law creep to thermally activated glide was observed. In Cu-alloy films, the addition of a small solute concentration effectively suppressed grain boundary-mediated diffusional creep, and deformation became more solute-drag controlled during the heating segment, while during the cooling segment, deformation was controlled by power-law creep behavior with the stress exponent increasing with decreasing temperature. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Electronic Materials, Thin Films and Interfaces, Other |