About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
|
| Presentation Title |
Mechanisms of Indium Addition in Modulating Interfacial Reactions and Enhancing the Mechanical Properties of Solder Joints |
| Author(s) |
Yi-Wun Wang, Jang-Cheng Fang, Wei-Lun Chen |
| On-Site Speaker (Planned) |
Yi-Wun Wang |
| Abstract Scope |
This study systematically investigates the effects of indium (In) addition on the microstructural evolution of SnBi/Cu joints, aiming to alleviate the brittleness and Bi segregation issues in low-temperature SnBi solders under prolonged thermal exposure. The solder samples were subjected to reflow and extended solid-state thermal aging for up to 2000 h at various temperatures. Microstructural and mechanical characterizations were conducted using SEM, EPMA, FIB, TEM, and nanoindentation techniques. The results reveal that the addition of In effectively suppresses the growth of Cu₃Sn intermetallic compounds by promoting the formation of finer, equiaxed Cu₆Sn₅ grains, which in turn facilitate atomic diffusion into the solder matrix. Furthermore, the In-modified joints, benefiting from grain refinement and solid-solution strengthening, exhibit excellent tensile strength at 80 °C, with ductile fracture consistently occurring within the solder matrix. This study provides critical insights into long-term interfacial stability and contributes to the development of reliable and energy-efficient low-temperature soldering technologies. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Phase Transformations |