About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Role Of Indium And Antimony In Enhancing The Microstructure And Mechanical Performance Of SAC305 Solder Alloy |
| Author(s) |
Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz |
| On-Site Speaker (Planned) |
Nur Syahirah Mohamad Zaimi |
| Abstract Scope |
This study investigates the effects of indium (In: 0–15 wt.%) and antimony (Sb: 0–1.5 wt.%) additions on SAC305 prepared via casting. Synchrotron Micro-XRF mapping confirmed uniform distribution of In and Sb within the solder matrix, while Synchrotron X-ray Diffraction (XRD) revealed their phase formation and transformation behaviors. Sb significantly refines the microstructure by reducing β-Sn crystallite sizes and thinning the interfacial intermetallic compound (IMC) layer, enhancing joint reliability and thermal stability. In contrast, In additions improve mechanical properties through the formation of new intermetallic compounds. Both elements reduce undercooling and increase strength, with Sb acting as an effective grain refiner and In contributing via precipitation strengthening. These insights provide a pathway to tailor SAC305 alloys for enhanced performance and reliability in electronic packaging applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Characterization, Joining |