About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Rapid and Low-Temperature Formation of Full CoSn₃ IMC Joints for Power Chip Packaging by TLP Process |
| Author(s) |
Shuang Liu, Limin Ma, Fu Guo |
| On-Site Speaker (Planned) |
Shuang Liu |
| Abstract Scope |
To address the requirements of low-temperature bonding and high-temperature service in power devices, a cost-effective packaging method was developed to form a full Co-Sn intermetallic compound (IMC) layer via transient liquid phase (TLP) processes. Utilizing the rapid diffusion of Co-based coatings, a full CoSn₃ IMC joint was achieved at 240 ℃ within 10 minutes, greatly reducing bonding temperature and time compared to traditional TLP systems. First-principles calculations confirmed that Co atoms in CoSn₃ possess the highest intrinsic diffusion coefficient compare to Cu-Sn, and Ni-Sn systems. This process features low material cost, simple operation, and requires no reducing atmosphere. Joints formed under low pressure (<1 MPa) exhibited strengths above 40 MPa and low porosity. The low hardness (<4 GPa) of CoSn₃ provided superior ductility. Further optimization of the crystallinity of coating could further reduce the bonding temperature and time while enhancing the strength and ductility, providing a promising strategy for advanced power chip packaging. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Thin Films and Interfaces, Other |