About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
|
| Presentation Title |
Enhanced Corrosion Resistance and Reliability of Coated Copper Wire Bonding in Automotive Electronics via Interface Engineering |
| Author(s) |
Chien-Pan Liu |
| On-Site Speaker (Planned) |
Chien-Pan Liu |
| Abstract Scope |
Cu wire bonding has emerged as a cost-effective, high-reliability alternative to Au wire in automotive semiconductor packaging. Recent advances in Pd-coated Cu and Au-coated Cu wires, combined with interface-engineered bonding pads, significantly enhance bonding performance and long-term durability. Pd-coated Cu wires provide superior oxidation resistance and stable free air ball formation, while Au-coated Cu wires improve interfacial wettability and suppress initial oxidation during thermosonic bonding. Optimized Ni/Pd/Au pad metallurgies and Al-Cu interfaces effectively control intermetallic compound (IMC) growth kinetics. Electrochemical corrosion testing under biased humidity conditions (HAST and high-temperature storage) demonstrates that surface passivation strategies and Pd diffusion barriers markedly reduce Cu-Al IMC corrosion rates and stabilize interfacial reactions, substantially improving reliability under thermomechanical and environmental stress. Comprehensive validation following AEC-Q006 Rev. B protocols confirms that integrating coated Cu wire systems with engineered pad architectures achieves robust, next-generation automotive interconnect reliability, balancing electrical performance, cost efficiency, and environmental robustness. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Process Technology, Mechanical Properties |