About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Kinetic Analysis of Segregation and Homogenization Behavior in Indalloy 227 (Sn-20In-2.8Ag) Solder |
| Author(s) |
Yu-Hsin Lin, C. Robert Kao |
| On-Site Speaker (Planned) |
Yu-Hsin Lin |
| Abstract Scope |
This study investigates the homogenization behavior of Indalloy 227 solder alloy through isothermal treatments at 60–105 °C, focusing on the correlation between the low-temperature DSC endothermic peak and the fraction of β-InSn phase predicted by thermodynamic calculations. Microstructural evolution was analyzed using SEM and EPMA to examine elemental distributions and segregation. Phase identification and mechanical properties were further evaluated using XRD and Vickers hardness tests. Although both XRD and hardness showed limited sensitivity to early-stage homogenization, DSC results revealed a significant and progressive decay in the low-temperature endothermic peak with increasing treatment time. A kinetic model was developed to describe the time-dependent evolution of segregation ratio and phase uniformity, providing quantitative insight into the homogenization process and offering practical guidance for thermal treatment strategies aimed at stabilizing solder performance in low-temperature applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Phase Transformations, Solidification |