About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Solderability and Interconnect Performance in Additively Manufactured Flex Cables |
| Author(s) |
Joshua Minster, Hannah Fowler, Emily Huntley , Aiden Hayes, Steven DiGregorio |
| On-Site Speaker (Planned) |
Joshua Minster |
| Abstract Scope |
Additively manufactured flex cables present a promising route for rapid fabrication of customized electronic interconnects, but reliable solder joining remains limited by substrate–conductor adhesion and thermal processing. This work investigates solder joint behavior between copper pins and inkjet-printed silver pads on printed acrylate substrates using eutectic SnPb and low-temperature lead-free solders. Emphasis is placed on pad anchoring strategies designed to improve adhesion between the printed silver and polymer substrate. Pad geometries with increasing anchor density were evaluated to determine their influence on adhesion during soldering and mechanical loading. Mechanical testing was used to assess joint robustness, interfacial integrity, and failure behavior, with BGA shear data providing insight into load transfer and pad detachment mechanisms. The results establish design guidance for integrating soldered interconnects into additively manufactured flex cable architectures and support future evaluation of alternative flexible substrates.
SNL is managed and operated by NTESS under DOE NNSA contract DE-NA0003525 |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Additive Manufacturing, Joining, Electronic Materials |