About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
2026 Technical Division Student Poster Contest
|
| Presentation Title |
SPG-60: Formulation and Processing of a Stable, High‑Load Tungsten Photoresin for Dense Tungsten Architectures |
| Author(s) |
Md Shahjahan Mahmud, Jose Miguel Gonzalez, Juan E. M. Urbay, Ivanna Neyra, Katja Michael, Yirong Lin, Brian E. Schuster |
| On-Site Speaker (Planned) |
Md Shahjahan Mahmud |
| Abstract Scope |
Tungsten is an essential refractory metal for extreme environments due to its exceptional chemical, thermal, and radiation stability, as well as high hardness. Vat photopolymerization (VPP) offers a promising route for fabricating complex tungsten architectures with superior surface quality compared to powder bed fusion or directed energy deposition; however, the development of stable, high-load tungsten photoresins remains a major challenge. High particle density promotes rapid sedimentation, resulting in poor print quality, limiting the achievable part size, density, and dimensional control. This work presents a resin engineering strategy for stable, high-load tungsten photoresins tailored for VPP. A high-capacity commercial resin matrix is combined with a tungsten salt and a rheology-modifying additive to increase yield stress, suppress sedimentation while maintaining sufficient cure depth at tungsten contents above 44 wt%. The resulting photoresin enables DLP of tungsten-rich precursors that are converted into complex, dense tungsten parts through debinding and sintering. |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Additive Manufacturing, Process Technology, Other |