About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Late News Poster Session
|
| Presentation Title |
F-69: Copper-Inconel 718 Multimaterial Pad Using Blue Laser Powder Blown Directed Energy Deposition for Thermal Management |
| Author(s) |
Donghee Kang, Min Liang Wang, Kootak Hong, Seunghwoi Han, Hyun Wook Kang, Jihoon Jeong |
| On-Site Speaker (Planned) |
Jihoon Jeong |
| Abstract Scope |
The increasing demand for high-current and high-frequency semiconductor chips results in localized heat fluxes exceeding several hundred W/cm², leading to steep thermal gradients within the substrate and structural instability. Conventional thermal management structures are limited in mitigating such hotspots, especially within constrained design spaces. We propose a three-dimensional multimaterial thermal pad designed to enhance lateral heat spreading while maintaining uniform surface temperature. The thermal pad was fabricated using a blue laser powder-blown directed energy deposition (LP-DED) process, enabling precise control of powder composition during deposition. By spatially varying the ratio of pure copper and Inconel 718 along the x-y plane and build height, directional thermal control was achieved. To ensure process stability, a monitoring system was integrated, including a CMOS camera, a two-color pyrometer, a multispectral camera, and an IR camera. This work demonstrates the potential of composition-controlled LP-DED for fabricating thermal pads for next-generation semiconductor devices. |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Additive Manufacturing, Copper / Nickel / Cobalt, Characterization |