| Abstract Scope |
With the advancement of 3DIC packaging, Metal-to-metal bonding such a solder-free direct bonding technique increasingly used in advanced packaging in need; in the past, conventional copper-to-copper direct bonding needs a higher bonding temperature to achieve a well bonding quality, which may be challenging in advanced packaging. To find out a solution for decreasing the requirement of bonding temperature, this study epitaxy silver on copper to develop different microstructure of the bonded samples, further, to investigate the bonding quality and bonding mechanism. This new technology can be a feasible method because when the requirement of power and performance in PPAC (power, performance, area, and cost) metrics become higher, the sustainable material may be in need, however, take a risk to changing a new material seem to be unintelligent, moreover, it has a great potential to be developed in the semiconductor industry due to thinner epitaxial layer is economical. |