About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
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| Symposium
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Advancing the Frontier of Powder Materials Processing and Sintering: A MPMD/EPD Symposium in Honor of Eugene Olevsky
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| Presentation Title |
On the pronounced mode angle dependency of the interface fracture toughness of pressureless sintered silver interconnects: Identification of dissipative micro-mechanisms |
| Author(s) |
Noud Schoenmakers, Johan Hoefnagels, Edsger Smits, Olaf van der Sluis |
| On-Site Speaker (Planned) |
Noud Schoenmakers |
| Abstract Scope |
This study examines the failure mechanisms affecting the fracture toughness of two pressureless sintered silver interconnects during mixed-mode delamination. The two materials used contain nanoparticles (NP) and microflakes (uF). The adhesives are sintered between two copper plates electroplated with a silver backside metallisation layer, and tested using the Miniature Mixed Mode Bending (MMMB) setup. Fracture behaviour is assessed using in-situ optical microscopy and SEM analysis. Differing microstructures lead to notable differences in failure behaviour and fracture toughness. The main failure mechanisms are interface delamination and bulk fracture. The NP-interconnect shows increasing fracture toughness with mode angle, while the uF-interconnect shows a never reported before dependency with a global minimum. The fracture morphologies of the delaminated samples are analysed to explain the difference in failure behaviour using SEM images. This study offers valuable insights into the complex interplay between the interconnect’s microstructures, failure mechanisms, and the resulting interface fracture toughness. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Electronic Materials, Powder Materials |