About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
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| Symposium
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Electronic Packaging and Interconnection Materials III
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| Presentation Title |
Investigation of Interfacial Reactions of the Sn-9Zn solder with Ni-xPd substrates at 240, 270, 300, and 330oC
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| Author(s) |
Shao-En Chiou, Yi-Shan Lee, Yee-Wen Yen |
| On-Site Speaker (Planned) |
Shao-En Chiou |
| Abstract Scope |
In this study, the Ni-xPd (x = 0, 0.5, 1.5, and 3.0 wt.%) alloys were prepared using arc melting and reacted with Sn-9Zn solder (SZ) to evaluate the feasibility of using the Ni-xPd alloy as a diffusion barrier layer. The SZ/Ni-xPd couples were reacted at 240, 270, 300 and 330oC for 10 to 300 min. The results revealed that the Ni5Zn21 phase was formed in all couples. At short reaction times (≤1 h), the addition of Pd suppresses the formation of the Ni5Zn21 phase, with a noticeable reduction in phase thickness as Pd content increases. At short reaction times (≤1 h), the addition of Pd suppresses the formation of the Ni5Zn21 phase, with a noticeable reduction in phase thickness as Pd content increases. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Other |