About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Effects of Zn concentration on the interfacial evolution in 50Sn-48Bi-xZn/Cu solder joints during aging conditions |
| Author(s) |
Yu-Ting Tseng, Yu-Hsin Lin, C. Robert Kao |
| On-Site Speaker (Planned) |
Yu-Ting Tseng |
| Abstract Scope |
Sn-Bi solder has been recognized as promising low-temperature lead-free solder. However, excessive growth of intermetallic compounds (IMCs) and Bi phase coarsening phenomenon during aging affects the reliability of Sn-Bi solder joints. In this research, the interfacial reactions of 50Sn-48Bi-xZn(x=0.5-6) solders and Cu substrate were studied. A minor amount of Zn element was added for suppression of interfacial IMC growth and refinement microstructure. Moreover, to avoid the formation of ZnO affecting the interfacial evolution, underfill was applied on the solder surface to prevent oxidation. In microstructure analysis, compounds such as Cu6(Sn, Zn)5 and Cu5Zn8 were formed at the interface after adding different amounts of Zn. To realize the evolution of IMC formation, the related IMCs transformation was explained by the Cu–Sn–Zn isotherm with the diffusion path concept for the different addition of Zn in the solder during aging. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Phase Transformations |