About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Amorphous Co-P Coating Enabled In-Situ Formation of CoSn₃ Skeletons for Enhanced Thermal Fatigue Resistance of Solder Joints |
| Author(s) |
Limin Ma, Fu Guo, Shuang Liu |
| On-Site Speaker (Planned) |
Limin Ma |
| Abstract Scope |
To address the challenge of thermal fatigue in solder joints, this study presented a novel strengthening approach by constructing a dense in-situ skeleton of CoSn₃ laths, enabled by an amorphous Co-15P interfacial coating. During reflow soldering, Co atoms from the coating rapidly diffused into the molten Sn-Ag solder, spontaneously forming numerous CoSn₃ laths that acted as a reinforcing skeleton and refined the β-Sn grains. This dual mechanism, second phase strengthening and grain refinement, effectively inhibited the initiation and propagation of thermal fatigue cracks. Compared with traditional Cu or crystalline Co-4P coatings, solder joints with the Co-15P interface exhibited superior resistance to crack formation and maintained higher shear strength above 35 MPa after 400 thermal cycles between −50℃ and 150℃. The formation of a discontinuous CoSn₃/β-Sn interface further prevented brittle interfacial fractures. This strategy provided a promising method to enhance the reliability of solder joints subjected to severe temperature cycling. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Surface Modification and Coatings, Thin Films and Interfaces |