| Abstract Scope |
In this study, the Cu/Sn and In/Ni/Cu multilayers were bonded using the solid-liquid interdiffusion bonding (SLID) method to form the Cu/Sn/In/Ni/Cu multilayer couples. The couples were initially reflowed at 180 and 200oC for 10 min, and then they were aged at 100oC for durations ranging from 10 to 300 h. After reflowed at 180oC, the Cu/(Cu, Ni)6(Sn, In)5/γ-InSn4/Ni/Cu was observed at the interface. When the couples were aged at 100oC, the Cu/(Cu, Ni)6(Sn, In)5/γ/(Cu, Ni)6(Sn, In)5/(Cu, Ni)(In, Sn)2/Ni/Cu was found. When the couples were reflowed at 200oC for 10 min, the micrograph at the interface was Cu/(Cu, Ni)6(Sn, In)5/γ/(Cu, Ni)6(Sn, In)5/Ni/Cu. When the aging time was increased to 70 h or more, the microstructure at the interface was transformed to Cu/(Cu, Ni)6(Sn, In)5/(Cu, Ni)(In, Sn)2/Ni/Cu. |