About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Characterization of Minerals, Metals and Materials 2026 - In-Situ Characterization Techniques
|
| Presentation Title |
In-situ Micro-CT Investigation of Thermal Deformation in Semiconductor Devices |
| Author(s) |
Ksenija Nikolic, Jan Dewanckele, Marijn Boone, Denis Van Loo |
| On-Site Speaker (Planned) |
Ksenija Nikolic |
| Abstract Scope |
Failure analysis in semiconductor devices requires accurate and non-destructive methods to observe internal changes under thermal stress. In this study, micro-computed tomography (micro-CT) is combined with in-situ heating to investigate how critical components within semiconductor packages deform during thermal cycling. This technique enables detailed 3D imaging of the internal structure at different temperature stages without damaging the sample. By capturing these structural changes throughout the heating process, early-stage defects and potential failure points can be identified and monitored. The use of in-situ micro-CT provides valuable insights into the mechanical behavior and reliability of semiconductor devices under thermal loading. This approach supports predictive failure analysis and helps guide design improvements in advanced electronic packaging. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Other, Other |