About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
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| Presentation Title |
Thermal Shock Reliability Evaluation of Ag-Al Paste Joints in SiC Power Modules |
| Author(s) |
Ryoma Tokonami, Chuantong Chen, Shigehiro Maeda, Mitsuteru Mutsuda, Kazutaka Takeshita, Yoshiji Yamaguchi, Yashima Momose, Katsuaki Suganuma |
| On-Site Speaker (Planned) |
Ryoma Tokonami |
| Abstract Scope |
Ag die-attach materials are commonly used in SiC power modules because of their high thermal and electrical conductivity. However, their reliability can decrease under thermal shock due to thermal stress accumulation. Cu pastes are low-cost alternatives, but oxide layers on Cu particles can reduce thermal conductivity. In this study, Ag-Al pastes with different Al contents were evaluated for interfacial adhesion and thermal shock reliability between a substrate and a SiC chip. The initial shear strength of the Ag joint was 61.2 MPa, but it dropped to 32.1 MPa after 500 thermal shock cycles because the porous interfacial structure was damaged by thermal stress. In contrast, Ag-Al sintered pastes showed improved reliability. For the paste containing 40 vol% Al, the shear strength decreased only slightly, from 32.1 MPa to 29.8 MPa after 500 cycles. These results indicate that Al addition enhances the thermal shock reliability of Ag-based sintered joints. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Electronic Materials, |