About this Abstract |
| Meeting |
MS&T25: Materials Science & Technology
|
| Symposium
|
Advanced Coatings for Wear and Corrosion Protection
|
| Presentation Title |
Effects of Cu, Sn, and Mn additions on intermetallic layer growth in hot-dip aluminizing with Al-9Si bath |
| Author(s) |
Jihun Choi, Eui-Jin Jung, Dae-Yoon Kim, Joo-Youl Huh |
| On-Site Speaker (Planned) |
Jihun Choi |
| Abstract Scope |
Hot-dip aluminizing is a widely employed technique to enhance the corrosion and oxidation resistance of steel, especially for high-temperature applications. This study investigates the effects of adding Cu, Sn, and Mn to Al-9 wt% Si baths on the formation and growth of intermetallic compounds (IMCs) during hot-dip aluminizing of low-carbon steel at 620°C and 675°C. Bath temperatures were selected based on phase diagram evaluations using Thermo-Calc software. Cu and Sn additions had minimal impact on IMC growth, forming τ5(H)-Al8Fe2Si/η-Fe2Al5 bilayers at 675 °C and τ6-Al4.5FeSi/τ5(H)-Al8Fe2Si/η-Fe2Al5 trilayers at 620 °C. Notably, both the total IMC thickness and the η-Fe2Al5 layer increased more rapidly at the lower temperature. In contrast, adding 1 wt% Mn resulted in τ5(H)-Al8Fe2Si/η-Fe2Al5 bilayers at both temperatures and effectively suppressed η-Fe2Al5 growth at 620 °C. Possible mechanisms for the unexpected acceleration of η-Fe2Al5 growth at the lower temperature are discussed. |