About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior at the Nanoscale VIII
|
| Presentation Title |
Comparison of Mechanical Properties of Cu–Al Thin Films Using MEMS-Based Tensile Testing and Nanoindentation |
| Author(s) |
donghyun park, Dongwoo Lee |
| On-Site Speaker (Planned) |
donghyun park |
| Abstract Scope |
We investigated the mechanical properties of Cu−Al thin films using MEMS−based tensile tests and nanoindentation to compare their effectiveness in characterizing thin film behavior. Thin films were fabricated by co−sputtering with Al content ranging from 5−16 at% while maintaining a film thickness of approximately 340 nm. Al content above 6 at% increased yield strength (650−940 MPa) and the H/Er ratio. Moderate alloying enhance strength without a loss in ductility. TEM analysis confirmed the presence of nano twins in these compositions, through their spacing and contribution to strengthening remain under investigation. A positive trend was observed in H/Er and tensile strength, implying that indentation−based values may partially correlate with tensile behavior under specific conditions. These results offer preliminary insights into the influence of composition and microstructure on mechanical response and suggest that MEMS−based tensile testing and nanoindentation can provide complementary information when evaluating thin film strength and ductility at small scales. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, Thin Films and Interfaces, Copper / Nickel / Cobalt |