About this Abstract |
| Meeting |
2022 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnections
|
| Presentation Title |
Die-bonding Performance and Mechanism of Ag Micron Paste with Pressure-less Sintering |
| Author(s) |
Tetsu Takemasa, Chuantong Chen, Katsuaki Suganuma |
| On-Site Speaker (Planned) |
Tetsu Takemasa |
| Abstract Scope |
Ag particle paste sintering has been developed and shown a good performance in areas such as high-temperature reliability and high electronic conductivity. Recently, it was found that the microstructure of a sintered Ag layer exhibits a coarse-dense inhomogeneous distribution after sintering, which depends on the loading speed of a die during the chip mounting process due to the flow characteristics of the Ag particle paste. In this work, the effect of the die mounting speed and the push-in amount (push depth) in the die mounting process on the microstructure of the sintered Ag layer, shear strength and thermal cycling reliability of Ag sinter joint structures were investigated. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, |