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Meeting 2026 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2026)
Symposium 2026 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2026)
Presentation Title Effect of Powder Spreading Strategy on the Densification of Binder-Jetted Copper Components
Author(s) Zakki Fuadi Emzain, Alkim Aydin, S. Can Erman, Ahmet Kus, Kamran Mumtaz
On-Site Speaker (Planned) Zakki Fuadi Emzain
Abstract Scope Binder jetting additive manufacturing offers a promising alternative route for processing copper components, particularly where LPBF faces challenges associated with the high reflectivity and thermal conductivity of copper. However, achieving high sintered density in binder-jetted copper remains challenging and is strongly influenced by powder bed quality during layer deposition. This study investigates the effect of powder spreading strategy on the green and sintered properties of binder-jetted copper fabricated using a customised binder jetting system with an aqueous PVA binder. Layer thickness (80 μm) and sintering temperature (1075°C) were maintained constant while three spreading strategies were evaluated: single spreading, double spreading in the same direction, and bidirectional double spreading. Double spreading in the same direction achieved the highest green density (51.3 ± 0.81%) and sintered relative density (95.61 ± 0.77%). The results demonstrate the significant influence of powder spreading strategy on powder bed packing and densification behaviour in copper binder jetting.
Proceedings Inclusion? Undecided

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