About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Effect of Cu Processing Conditions on the high-temperature stability and Thermal Properties of Cu Sintered Spacers |
| Author(s) |
Junha Baik, Byeongchan Kim, Minsu Kim, Dongjin Kim |
| On-Site Speaker (Planned) |
Junha Baik |
| Abstract Scope |
Cu–Mo–Cu lamellar spacers used in double-side-cooled (DSC) power modules exhibit excellent thermal conductivity and a low coefficient of thermal expansion (CTE), but crack formation during electrical discharge machining (EDM) remains a major issue that reduces manufacturing yield. In this study, Cu/Cu-sintered layer/Cu spacers were fabricated using both pure Cu plates and pre-rolled and annealed Cu plates, and their bonding characteristics and thermophysical properties were systematically compared. A porous Cu layer and the Cu/Cu-sintered layer/Cu structure were fabricated by pressure-assisted sintering, and an aging test was conducted at 250 °C. The rolled and annealed Cu spacer exhibited higher thermal conductivity, lower CTE, and a lower maximum junction temperature in CFD simulations than the conventional Cu-sintered spacer. This study demonstrates that employing rolled and annealed Cu plates effectively enhances the thermophysical performance and thermal management capability of Cu-sintered spacers for DSC power modules. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Copper / Nickel / Cobalt, Characterization, Other |