About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Quasi in-situ observation of microstructural evolution for Sn-3Ag-0.5Cu solder joints under a wide Temperature range thermal cycling |
| Author(s) |
Tianhong Gu, Xue Lei, Xiaojuan Hu, Guang Zeng |
| On-Site Speaker (Planned) |
Tianhong Gu |
| Abstract Scope |
With the rapid development of electronics manufacturing, the reliability of solder joints under extreme temperatures has become critical for high-density electronic packaging. This study investigated the early-stage microstructure evolution of Cu/SAC305/Cu solder joints under extreme thermal cycling (-65 to 200 °C). Five joints, including polycrystals with random orientation or cyclic twin grain structure, were analysed in-situ with optical microscopy and quasi in-situ with SEM and EBSD. Grain boundary coarsening was observed and became more pronounced with increasing thermal cycles. EBSD results revealed continuous orientation rotation, typically toward a particular direction they were originally close to. Deformation bands and slip traces developed in coarsened regions and became more obvious with increasing thermal cycles. Additionally, recrystallisation was generated within the Sn matrix near the Cu/SAC305 interface. These findings demonstrate deformation mechanisms of SAC305 solder joints under extreme temperatures, providing theoretical support for potential design in high-reliability aerospace and electric vehicle applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Other |