About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Chemistry and Physics of Interfaces
|
| Presentation Title |
In-Situ SEM Observation of Thermal-Elastic Processing in Fine Grained Copper |
| Author(s) |
Carson Sutton, Wenwu Xu |
| On-Site Speaker (Planned) |
Carson Sutton |
| Abstract Scope |
Thermal-elastic processing (TEP) is intended to drive localized grain-boundary changes through coupled heat and elastic stress, but most evidence has been obtained after processing. This poster presents an in-situ SEM approach for observing TEP responses directly in fine-grained pure copper. Dog-bone plate specimens were loaded using an in-house tensile rig integrated with a SEM-compatible heating stage and tested at 200 C under sub-yield stress conditions. Real-time imaging was used to track boundary segments, triple junctions, and near-boundary surface relief across nano- and micro-scale fields of view. The observations clarify how grain boundaries evolve during thermal-mechanical exposure, including local boundary migration, roughening or serration, and strain accommodation without macroscopic plastic yielding. By connecting direct SEM evidence with post-test microstructural comparison, this work identifies experimental signatures of TEP and provides mechanism-level insight into how elastic loading and moderate heating modify copper interfaces. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Mechanical Properties, Other |