About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
The Effect of Electromigration on Solder Joint Morphology and Properties |
| Author(s) |
Javier Flores, Sitaram Panta, Mohammed Genanu, Faramarz Hadian, Eric J. Cotts |
| On-Site Speaker (Planned) |
Eric J. Cotts |
| Abstract Scope |
Electromigration changes the morphology and properties of solder joints. It can include atomic segregation, void formation, and corresponding changes in electrical resistivity. Initial conditions such as temperature and current density, and solder joint geometry and composition, affect the nature and severity of this phenomenon. Black’s equation provides a means to characterize failure rates of solder joints during such current stressing. A more fundamental examination of electromigration can yield expressions for failure rates which are sensitive to solder joint geometry, and to solder morphology and composition. We present such a treatment of electromigration in Sn-Bi based solder joints, and preliminary considerations of other solder systems. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Characterization, Phase Transformations |