About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Photomechanical and Electromechanical Effects in Structural and Functional Materials
|
| Presentation Title |
Effect of Photothermal Aging on In Situ and Ex Situ Adhesion of Thin Film Energy Devices |
| Author(s) |
Abhijit Prekash |
| On-Site Speaker (Planned) |
Abhijit Prekash |
| Abstract Scope |
Perovskite photovoltaics are a next-generation solar technology with low manufacturing costs and the potential to surpass conventional silicon solar cells in efficiency. However, weak interfacial adhesion promotes delamination and limits device lifetime. There is a lack of knowledge about the evolution of adhesion within perovskite devices during aging. In this work, we use a double cantilever beam approach to compare in situ and ex situ adhesion under controlled photothermal conditions. Ex situ measurements revealed that photothermal aging can significantly increase bond strength of the interface due to aging, whereas in situ testing showed a tenfold reduction in adhesion at −20 °C compared with room temperature, potentially due to interface embrittlement. Overall, this study captures contrasting interfacial behavior during in situ and ex situ mechanical measurements and makes progress toward quantifying mechanical integrity of thin film devices under a range of operating conditions and the resulting evolution of defects. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Thin Films and Interfaces, Electronic Materials, Mechanical Properties |