About this Abstract |
| Meeting |
MS&T26: Materials Science & Technology
|
| Symposium
|
Joining/Bonding of Dissimilar Materials
|
| Presentation Title |
Interfacial Microstructure and Diffusion Bonding Mechanisms in Aluminum-Copper Systems with Ultra-Thin Copper Sheet |
| Author(s) |
Hossein Abbasi, Lei Chen |
| On-Site Speaker (Planned) |
Hossein Abbasi |
| Abstract Scope |
The rapid growth of electric vehicles has increased the need for lightweight motor components with high electrical and thermal conductivity and reliable mechanical joints. This study presents a diffusion bonding method for aluminum–copper joints using ultra-thin copper foils (<50 μm) as interlayers to improve joint quality and conductivity. The approach also addresses skin-effect-related current distribution issues in EV motor applications. The effects of bonding temperature, time, and pressure on interfacial microstructure and joint quality were systematically evaluated using a custom graphite clamping system for precise pressure control. Results showed that proper temperature and bonding time are essential for effective diffusion and uniform interfaces. Lower bonding pressure and improved surface finish reduced voids, limited intermetallic compound formation, and improved dimensional stability. Reducing pressure from 26 MPa to 13 MPa decreased thickness change from 0.130 mm to 0.044 mm. This method offers a scalable solution for high-performance EV conductive joints. |