About this Abstract |
| Meeting |
2026 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2026)
|
| Symposium
|
2026 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2026)
|
| Presentation Title |
Flash Thermography for Thermal Diffusivity and Density Measurement of Cured Binder-Jet Samples in the Presence of Thermal Contact Resistance |
| Author(s) |
Shu Wang, Nathan B. Crane |
| On-Site Speaker (Planned) |
Shu Wang |
| Abstract Scope |
Density is a key indicator of part quality in binder jetting, but density measuremetns remain difficult. This work considers ex-situ measurement of cured SS316L samples as a possible enhancement of traditional witness parts and a step towards in-situ monitoring. A thermal contact resistance (FT-RTc) was added to a typical 1D Flash thermography (FT) model to measure thermal diffusivity and density in cured samples printed at 40%, 70%, and 100% binder saturation . The results show that FT can be extended from unbound powder to cured printed samples. Thermal diffusivity and density were both retrieved, although density uncertainty in cured samples was much larger than in previous unbound-powder measurements. An absorptivity-based correction substantially reduced the sample-level density error, indicating that absorptivity variation is a major source of cured-sample density uncertainty. The FT-Rtc model also remained effective under substantially different contact conditions. |
| Proceedings Inclusion? |
Undecided |