About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Microstructure and Interfacial Evolution of Ag-modified In-Sn Alloys |
| Author(s) |
Tan Yi Pei, Mohd Arif Anuar Salleh, Flora Somidin, Zaliman Sauli, Kazuhiro Nogita |
| On-Site Speaker (Planned) |
Mohd Arif Anuar Salleh |
| Abstract Scope |
In-rich Sn-based alloys are attractive low-temperature solder materials, but challenges remain in achieving stable microstructures and reliable interfaces. This study explores the effect of Ag addition by examining both bulk alloys and solder joints. Transmission electron microscopy (TEM), selected area electron diffraction (SAED), and energy-dispersive X-ray spectroscopy (EDX) were used to investigate microstructural changes in solder joints. High-speed shear testing and thermal aging were also conducted to evaluate the mechanical performance and structural stability. This research aims to provide insights for optimizing In-based solders in advanced electronic applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Process Technology, |