About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Comparison of (enhanced) sintered silver interconnects to traditional solders for high-power semiconductor devices: a TMCL study |
| Author(s) |
Noud Schoenmakers, Johan Hoefnagels, Edsger Smits, Willem van Driel, Guo Qi Zhang, Olaf van der Sluis |
| On-Site Speaker (Planned) |
Noud Schoenmakers |
| Abstract Scope |
Sintered silver has been identified as a promising alternative to traditional lead-based solders as the Primary Package Interconnect (PPI) for high-power semiconductor devices. However, during qualification testing, such as Thermo Mechanical Cycle Lifetime (TMCL) tests, cracks appear within the interconnect. Enhancing the sintered silver with additives could prevent the occurrence of these cracks. To this end, this study compares existing materials (high-lead and lead-less solders) to novel (additive enhanced) sintered silver interconnects in pQFN packages through TMCL testing. An analysis of all packages is performed through (in-situ) R_(DS(On)) measurements, Cross-sectional Scanning Acoustic Microscopy (CSAM) analysis and finally Scanning Electron Microscopy (SEM) images of cross sections. To better understand the experimental results, numerical simulations have been employed. The results provide valuable insights which will pave the way towards microstructural material design of additive-enhanced sintered silver PPIs. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Sustainability |