About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Microstructural Analysis of Ultrasonically Welded 316L/Copper Joints for Electrical Terminals |
| Author(s) |
Jhe-Yu Lin, Hsing-Yu Chen, Yan-Lin Chu |
| On-Site Speaker (Planned) |
Jhe-Yu Lin |
| Abstract Scope |
This study presents a parametric analysis of ultrasonically welded 316L stainless steel/copper joints designed for electrical terminal applications. Lap joints were fabricated using varying clamping forces (1000-3000 N) and welding times (0.25-4 s) at 15 kHz frequency. SEM, EDS, and EBSD techniques were employed to characterize interfacial microstructures and bonding mechanisms. Maximum joint strength of 2155 N was achieved at 3000 N clamping force within 1 second, representing 88% of base copper strength. Temperature measurements revealed optimal bonding at 0.3-0.5 Tm range. EBSD analysis demonstrated that copper experienced sequential microstructural changes, including grain refinement, recovery, recrystallization, and grain growth during welding cycles. Higher clamping forces accelerated strength development, while extended welding times caused strength degradation due to copper thickness reduction. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Mechanical Properties, Electronic Materials |