About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
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Heterostructured and Gradient Materials (HGM V): New Mechanistic Discoveries Enabling Superior Properties
|
Presentation Title |
Constitutive Model and Finite Element Analysis of Heterostructured Materials |
Author(s) |
Hyoung Seop Kim, Yongju Kim |
On-Site Speaker (Planned) |
Hyoung Seop Kim |
Abstract Scope |
The bimodal structure, one of the various heterogeneous microstructures, has been studied in an attempt to induce desirable strength-ductility synergies. We developed a physical-based constitutive model which represents the deformation mechanism well considering the evolution of geometrically necessary dislocations and statistically stored dislocation densities. Even though there are many complex correlations of grain size, volume fraction, and spatial distribution of soft coarse grain/hard fine grain in a bimodal structure, the bimodal structure-property linkage can be explored by adopting microstructure-based FEM simulations. This work demonstrates that the bimodal microstructure-property linkage can be analyzed quantitatively to facilitate finding optimal heterogeneous equiaxed bimodal structures. |
Proceedings Inclusion? |
Planned: |
Keywords |
Mechanical Properties, Modeling and Simulation, High-Entropy Alloys |