About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Cellulose Nanofiber Enhanced SAC Solder with Improved Reliability through Microstructure Control |
| Author(s) |
Chia-Jung Hsu, Kelvin Li, Chang-Meng Wang, Tsao-Cheng Huang, Chao-Chin Chang, Albert T. Wu |
| On-Site Speaker (Planned) |
Albert T. Wu |
| Abstract Scope |
The miniaturization of semiconductor packaging increases reliability demands on solder joints. This study proposes enhancing Sn–Ag–Cu (SAC) solder by uniformly incorporating low-cost, eco-friendly cellulose nanofibers (CNFs). After standard reflow processing, the CNF-enhanced solder showed refined microstructures and intermetallic compounds (IMCs), resulting in higher hardness and shear strength. CNFs reduced undercooling and promoted faster solidification. After 30 days of high-temperature storage, the CNF-added solder exhibited slower grain growth and better thermal stability than non-added SAC. Reflow tests using commercial PCBs demonstrated fewer voids and improved wetting. These enhancements led to improved mechanical and thermal reliability. The results demonstrate that CNFs are a highly effective additive for next-generation solder alloys, offering a scalable and sustainable route to meet the reliability demands of advanced electronic packaging. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Nanotechnology |